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专利名称：PAD CLEANING METHOD
发明人：MAVLIEV, RASHID A.,CHEN, HUNG CHIH申请号：US2007071701申请日：20070620
公开号：WO2008002811A3公开日：20081106
摘要：A method for cleaning a polishing pad is disclosed. In CMP and ECMP, apolishing pad must be conditioned to obtain good and predictable polishing results.During conditioning, debris is generated that must be removed to prevent processingdefects. An effective method to clean a polishing pad is disclosed herein. In oneembodiment, a washing fluid is directed at the pad to clean debris from the while asecond fluid is utilized to remove the washing fluid. In another embodiment, the washingfluid is provided by a high pressure water jet while the second fluid is provided by an airknife.
申请人：APPLIED MATERIALS, INC.,MAVLIEV, RASHID A.,CHEN, HUNG CHIH
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