Datasheet TLE 6216
Smart Quad Channel Low-Side Switch
Product Summary
· Low ON-resistance 2 x 0.2 W , 2 x 0.35 W (typ.)· Power - SO 20 - Package with integratedSupply voltageVS 4.8 - 32cooling area
Drain source voltageVDS(AZ)max 60
· Overload shutdown
On resistanceRON(typ) 1,2 0.2 · Selective thermal shutdown
RON(typ) 3,4 0.35 · Status monitoring
· Overvoltage protectionOutput currentID 1,22 x 5 · Shorted circuit protectionID 3,42 x 3 · Standby mode with low current consumption· µC compatible input
· Electrostatic discharge (ESD) protection
Application
Features
V
VWWAA
· All kinds of resistive and inductive loads (relays, electromagnetic valves)· µC compatible power switch for 12 and 24 V applications
· Solenoid control switch in automotive and industrial control systems
P-DSO-20-12
General description
Quad channel Low-Side-Switch (2x5A/2x3A) in Smart Power Technology (SPT) with four separate in-puts and four open drain DMOS output stages. The TLE 6216 is fully protected by embedded protec-tion functions and designed for automotive and industrial applications.
Block diagram
STBYGNDVSENAnormal functionSCB / overloadVBBIN1IN2IN3IN4ST1 as Ch. 1 as Ch. 1 as Ch. 1overtemperatureLOGICcross open load/ short to gndOutput StageOUT11 as ST 1 as ST 1 as ST 144ST2ST3ST4Gate ControlOUT4GNDV7.1Page 1 of 1718.10.02
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Pin Configuration (Top view)
P - DSO - 20 - 12
Pin Description
PinSymbolFunction1GNDGround
2OUT1Power Output channel 13ST1Status Output channel 14IN4Control Input channel 4
5VSSupply Voltage
6STBYStandby
7IN3Control Input channel 38ST2Status Output channel 29OUT2Power Output channel 2
10GNDGround11GNDGround
12OUT3Power Output channel 313ST3Status Output channel 314IN2Control Input channel 2
15GNDGround Logic
16ENAEnable Input for all four channels
17IN1Control Input channel 118ST4Status Output channel 419OUT4Power Output channel 4
20
GND
Ground
Heat slug internally connected to ground pins
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Datasheet TLE 6216
Detailed Block Diagram
VSSTBYinternal supplyOvertemperatureChannel 4ENAOvertemperatureChannel 1Open LoadIN1LOGICOverloadOUT1RPDST1Open LoadIN4OverloadLOGICOUT4RPDST4OvertemperatureChannel 3OvertemperatureChannel 2Open LoadIN2LOGICOverloadOUT2RPDST2Open LoadIN3OverloadLOGICOUT3RPDST3GNDV7.1Page 3 of 1718.10.02
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Datasheet TLE 6216
Block Diagram of Open Load Detection
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Datasheet TLE 6216
Maximum Ratings for Tj = – 40°C to 150°C
ParameterSupply voltage
Supply voltage operational range
Continuous drain source voltage (OUT1...OUT4)Input voltage IN1 to IN4, ENA
II <|10| mA
Input voltage STBYStatus output voltageOperating temperature rangeduring clamping; St = 30 minduring clamping; St = 15 minStorage temperature rangeOutput current per channelOutput current at reversal supplyStatus output current
Inductive load switch off dissipation energy Tj = 25°CElectrostatic Discharge Voltage (HBM) according to MILSTD 883D, method 3015.7 and EOS/ESD assn. StandardS5.1 – 1993Output 1-4 Pins
All other PinsThermal resistancejunction - case
Maximum operating lifetime (according to \"Ambient thermalconditions\")
VSTBYVSTTjTjTjTstgID(lim)ID 1,2ID 3,4ISTEAS
-
SymbolVSVSVDSVIN , VENA
-
Values
-0.3 ... + 40
+ 4.8 ... + 32
40
0.3 ... + 6-1.5…+6
UnitVVVVVV°C
- 0.3 ... + 40- 0.3 ... + 3240 ... + 150
175190
- 55 ... + 150overloadshutdown
- 4- 2- 5 ... + 5
50
AAmAmJVV
VESDVESDRthJCtb
40002000
210000
K/Wh
Ambient thermal conditions
TAmbient temperature
range
-40 °C-20 °C25 °C60 °C80 °C100 °C> 120 °C
operating periods
2 %10 %24 %34 %24 %5 %1 %
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Datasheet TLE 6216
Electrical Characteristics
Parameter and Conditions
VS = 4.8 to 18 V ; Tj = - 40 °C to + 150 °C(unless otherwise specified)1. Power Supply (VS)Supply current (Outputs ON)Supply current (Outputs OFF)VENA = L, VSTBY = HOperating voltageStandby current 2. Power Outputs
ON state resistance Channel 1,2ID = 1A; VS ³ 9.5 V
ON state resistance Channel 3,4ID = 1A; VS ³ 9.5 V
Z-Diode clamping voltage (OUT1...4)
Tj = 25 ° CTj = 125°C 1Tj = 150°C 2Tj = 25 ° C
1
Tj = 125°C
2
Tj = 150°C ID ³ 100 mA
RDS(ON)
0.2
0.50.5
RDS(ON)
0.35
0.750.75
VDS(AZ)RPD
IDlk
51254050506050300
mAmAµs
451410
20
6020
VkWWW
VSTBY = L
ISISVSIS
4.8
843210
mAmAVµA
Symbol
Valuesmin
Unit
typ
max
Pull down resistor Tj = 25 °CVSTBY = H, VIN = L Tj = -40 °C ...150°COutput Leakage Current VSTBY = L
Tj = -40°C...150°Cwafer test at 25°C
Output on delay time 3 ID = 1 AOutput off delay time 3ID = 1 AOutput on fall time 3 ID = 1 AOutput off rise time 3ID = 1 AOutput off status delay time 3 ID = 1 AOutput on status delay time 4Overload switch-off delay time
3. Digital Inputs (IN1, IN2, IN3, IN4, ENA)Input low voltageInput high voltageInput voltage hysteresis 4
Input pull down current
VIN = 5 V; VS ³ 6.5 V
Enable pull down current VENA = 5 V; VS ³ 6.5 V4. Digital Status Outputs (ST1 - ST4) open DrainOutput voltage lowLeakage current high 1
Measured on P-DSO-20 devices
2
tontofftfalltriset4t5tDSOVINLVINHVINHysIINIENAVSTLISTH
05551050
5
100
- 0.32.0501010
1003020
1.06.060400.52
VVmVµAµAVµA
IST = 2 mA
Measured on chip, bond wires not included
See timing diagram, resitive load condition; VS ³ 9 V This parameter will not be tested but assured by design
3
4
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Datasheet TLE 6216
Electrical Characteristics
Parameter and Conditions
VS = 4.8 to 18 V ; Tj = – 40 °C to + 150 °C(unless otherwise specified)5. Standby Input (STBY)Input low voltage
Input high voltage
Input current
6. Diagnostic Functions Open load detection voltage VENA = X, VIN = L, VDC = 0 5
Open load compare voltage
VENA = X, VIN = L, 18V ³ VDSC ³ VDS(OL) 5Open load current channel 1,2VENA = H, VIN = H
Open load current channel 3,4VENA = H, VIN = H
Overload threshold current channel 1,2Overload threshold current channel 3,4Overtemperature shutdown threshold 6Hysteresis
VSTBY = 18 V
VSTBYVSTBYISTBY
03.5
1VS300
VVµA
Symbol
Valuesmin
Unit
typ
max
VS ³ 6.5 VVS ³ 6.5 VVS ³ 6.5 VVS ³ 6.5 VVS ³ 6.5 VVS ³ 6.5 V
VDS(OL)VDS(OL)CID(OL) 1,2ID(OL) 3,4ID(lim) 1,2ID(lim) 3,4TthThys
0.525
VDSC-1.5
0.575
VDSC-1.0
*VsVmAmAAA
16016053170
107.55
480480
200
°CK
Table 1:
ChannelVDS(OL)1VDS(OL)2VDS(OL)3VDS(OL)4
Compared with Channel
4
321
5
VDSC is the output voltage of the corresponding channel, paired for open load detection Corresponding outputs are channel 1 and 4, channel 2 and 3 (see table 1).6
This parameter will not be tested but assured by design
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Datasheet TLE 6216
Application Description
This IC is especially designed to drive inductive loads (relays, electromagnetic valves).Integrated clamp-diodes limit the output voltage when inductive loads are discharged.
Four open-drain logic outputs indicate the status of the integrated circuit. The following conditions aremonitored and signaled:
- Overloading of output (also shorted load to supply) in active mode - Open and shorted load to ground in active and inactive mode- Overtemperature
Circuit Description
Input Circuits
The control and enable inputs, both active high, consist of schmitt triggers with hysteresis. All inputsare connected with pull-down current sources. Not connected inputs are interpreted as LOW.
In standby mode (STBY = LOW) the current consumption is greatly reduced. The circuit is active whenSTBY = HIGH.
If the standby function is not used, it is allowed to connect the standby pin directly to VS.Switching Stages
The four power outputs consist of DMOS-power transistors with open drains. The output stages areshorted loads protected throughout the operating range. Integrated clamp-diodes limit voltage over-shoots produced when inductive loads are demagnetized.
Parallel to the DMOS transistors there are internal pull down resistors. They are provided to detect anopen load condition in the off state. They will be disconnected in the standby mode.Protective Circuits
The outputs are protected against current overload and overtemperature.There is no protection against reverse polarity of the supply voltage.Error Detection
The status outputs indicate the switching state under normal conditions (LOW = off; HIGH = on). If anerror occurs, the logic level of the status output is inverted, as listed in the diagnostic table below.The state of the error detection circuits is directly dependent on the input status.
If current overload or overtemperature occurs, the error condition is stored into an internal register andthe output is shutdown. The reset is done by switching off the corresponding control input.
Open load is detected for all four channels in on and off mode. In the on mode the load current ismonitored. If it drops below the specified threshold value, then an open load condition is detected.
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Datasheet TLE 6216
In the off mode, the output voltage is monitored.
An open load condition is detected when the output voltage of a given channel is below 55 % of thesupply voltage VS. Also the output voltages of two outputs are compared against each other in off con-dition with a fixed offset of typ. 1.25 V to recognize GND bypasses. To suppress fault diagnosis duringthe flyback phase of the compared output, the diagnostic circuit includes a latch function.
Reset of this latch is done at end of the flyback phase, additionally it can be reset by a low signal onthe enable input or a high signal of the input line.See block diagram of open load detection on page 4.
Diagnostic Table
In general the status follows the input signal in normal operating conditions.If any error is detected the status is inverted.
Operating ConditionStandbyNormal function
StandbyInputSTBYLHHHHHHHHHHHHHHHH
EnableInputENAXLLHHLLHHHHLXHHLX
ControlInputINXLHLHLHLHHHHH ® LHHHH ® L
PowerOutputOUTOFFOFFOFFOFFONOFFOFFOFFONOFFOFFOFFOFFOFFOFFOFFOFF
StatusOutputSTHLLLHHHHLLLHLLLHL
Open load or short to ground
Overload or short to supply latched overload reset latchOvertemperature
latched overtemperature reset latch
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Datasheet TLE 6216
Diagnostic (continued)
The following diagrams show the dynamical behavior of the status output in case of differenterrors.
The symbol F defines the moment of failure occurrence.Output open load or short circuit to GND
FINSTOutput overload
FINSTOvertemperature of the chip
FINSTLoad Bypass
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Datasheet TLE 6216
Test CircuitOut 1Out 2Out 3STBY470nF1000µFV7.1
10k10k10k10kPage 11 of 17
ENAST1ST2ST3ST4IN1IN2IN3IN4GND18.10.02
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Datasheet TLE 6216
Application CircuitOut 1Out 2Out 3Vs470nFSTBYST1ST2ST3ST45V10k10k10k1000µF10kStatusOutputsControlInputsEnableInput
The blocking capacitor C is recommended to avoid critical negative voltage spikes on VS in case ofbattery interruption during OFF-commutation.
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Datasheet TLE 6216
Timing Diagrams
Output SlopeVINVINHVINLtVDSVS85%toffton15%ttfalltriseVSTt5t4tOverload Switch OFF DelayIDID(lim)ID(OL)ttdsoVSTtV7.1Page 13 of 1718.10.02
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Datasheet TLE 6216
Ordering codeType
Ordering Code
Package
TLE6216 Gon requestP - DSO - 20 – 12TLE6216 C
on request
Bare dice on wafer
Pad AssignmentOut4ST4IN1IN2ST3Out3ENAGND43DDNNGGPPTLE 621612DDNNGGPPStbyOut1ST1IN4VSIN3ST2Out2V7.1Page 14 of 17
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Datasheet TLE 6216
Package dimensionsAll dimensions in mm
15.74 +/- 0.113.7 -0.29 x =1.2711.43V7.11.270.4 +0.130.25MA20111.01.-/0+-/ 2+ .39.51101 x 45°PIN 1 INDEX MARKING +/-0.15A15.91.2 -0.30.13.18°2.88°8°6.38°11 +/-0.151)14.2 +/-0.3Page 15 of 17
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Revision List:01.09.2001Target DatasheetV101.11.2001First revisionV304.03.2002Second revisionV430.04.2002Third revision
V530.07.2002Preliminary DatasheetV609.09.2002Final DatasheetV718.10.02
Update typers
V7.1
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Datasheet TLE 6216
Published by
Infineon Technologies AG,Bereich KommunikationSt.-Martin-Strasse 76,D-81541 München
© Infineon Technologies AG 1999All Rights Reserved.Attention please!
The information herein is given to describe certain components and shall not be considered as warranted characteristics.Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Tech-nologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in questionplease contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written approval ofInfineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-supportdevice or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are in-tended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, itis reasonable to assume that the health of the user or other persons may be endangered.
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