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专利名称：LED PACKAGE STRUCTURE
发明人：CHIA-HUI SHEN,Tzu-Chien Hung,Jian-Shihn
Tsang
申请号：US12975232申请日：20101221
公开号：US20120012872A1公开日：20120119
专利附图：
摘要：An LED package structure includes a transparent substrate having a supportingface and a light-emergent face opposite to the supporting face, a housing disposed onthe supporting face, two electrodes disposed on the housing, an LED chip disposed on
the supporting face and electrically connected to the two electrodes, a reflecting layercovering the LED chip to reflect light emitted by the LED chip toward the transparentsubstrate, and a phosphor layer formed on the light-emergent face of the substrate. Thephosphor layer includes a plurality of layers each having a specific light wavelengthconversion range to generate a light with a predetermined color.
申请人：CHIA-HUI SHEN,Tzu-Chien Hung,Jian-Shihn Tsang
地址：Hukou Shiang TW,Hukou Shiang TW,Hukou Shiang TW
国籍：TW,TW,TW
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